基于修正叠层法的纸张导热性质测试方法研究

Modified Lamination Method for Thermal Conductivity Testing of Paper-Based Materials

关键词:  瞬态平面热源法  稳态热阻测试  芳纶纸  导热系数  薄膜

Key Words:Transient plane source method  Steady-state thermal resistance testing  Aramid paper  Thermal conductivity  Film

摘要:纸基材料的导热性能在电子、电气及摩擦等领域具有重要应用价值。然而，纸基材料的薄层、多孔结构及各向异性使其热导率测试面临诸多挑战。本文以芳纶纸为例，提出了一种精确测量纸张面内导热系数的新方法。该方法结合瞬态法和稳态法，通过测试叠层纸张的导热系数和层间热阻，推算出单层纸张的面内导热系数。研究分析了堆叠层数、施加压力等因素对测试结果的影响，评估了该方法在纸张面内导热系数测试中的适用性。

Abstract:The thermal conductivity of paper-based materials plays a crucial role in applications such as electronics, electrical engineering, and friction. However, the thin layers, porous structure, and anisotropic properties of paper-based materials present significant challenges in thermal conductivity testing. In this paper, a novel method is proposed for accurately measuring the in-plane thermal conductivity of paper, using aramid paper as an example. The method combines the transient and steady-state approaches to measure the thermal conductivity of stacked paper sheets and the interlayer thermal resistance, from which the in-plane thermal conductivity of a single paper layer is deduced. The influence of factors such as the number of stacked layers and applied pressure on the test results is analyzed, and the applicability of the method in measuring the in-plane thermal conductivity of paper is evaluated.